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Bump Update #699

Merged
merged 6 commits into from
Jan 27, 2023
Merged

Bump Update #699

merged 6 commits into from
Jan 27, 2023

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kenhoberkeley
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@kenhoberkeley kenhoberkeley commented Jan 26, 2023

Bumps previously assume same x, y pitch. This updates bumps such that:

  • Dimensions are now acceptable arguments for pitch key (i.e., vlsi.inputs.bumps.pitch, vlsi.inputs.bumps.pitch_x, vlsi.inputs.bumps.pitch_y are now all acceptable).
  • Global bump offset is available for unaligned bumps (e.g., vlsi.inputs.bumps.global_x_offset)
  • Corresponding backend tool updates.
  • Fixed PCB tool to adopt this scheme.
  • Fixed visualization to deal with pitch.

See: ucb-bar/hammer-cadence-plugins#87

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@harrisonliew harrisonliew left a comment

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Awesome!

However, it looks like you broke some pcb-action unit tests that use the bumps methods. Can you fix them? Probably just an update on the method calls.

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@harrisonliew harrisonliew left a comment

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Thanks for the new fixes!

@harrisonliew harrisonliew merged commit ecae2ca into master Jan 27, 2023
@harrisonliew harrisonliew deleted the bump_update branch January 27, 2023 00:29
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2 participants