-
Notifications
You must be signed in to change notification settings - Fork 2.1k
New issue
Have a question about this project? Sign up for a free GitHub account to open an issue and contact its maintainers and the community.
By clicking “Sign up for GitHub”, you agree to our terms of service and privacy statement. We’ll occasionally send you account related emails.
Already on GitHub? Sign in to your account
[Chef] Add heat pump device type #36457
Conversation
Changed Files
|
PR #36457: Size comparison from 882b76e to a24e0d0 Full report (3 builds for cc32xx, stm32)
|
Add new lines
PR #36457: Size comparison from 882b76e to cf9db78 Full report (3 builds for cc32xx, stm32)
|
Add new lines
PR #36457: Size comparison from 882b76e to 20331c0 Full report (24 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, nrfconnect, qpg, stm32, telink, tizen)
|
PowerSource Feature = WIRED
PR #36457: Size comparison from 882b76e to 5910c24 Full report (68 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, linux, nrfconnect, nxp, psoc6, qpg, stm32, telink, tizen)
|
Add Device Energy Management in EP1
cluster DiagnosticLogs
PR #36457: Size comparison from dfd3749 to ba0f9d9 Full report (68 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, linux, nrfconnect, nxp, psoc6, qpg, stm32, telink, tizen)
|
PR #36457: Size comparison from 2c11741 to 031a109 Full report (69 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, linux, nrfconnect, nxp, psoc6, qpg, stm32, telink, tizen)
|
There was a problem hiding this comment.
Choose a reason for hiding this comment
The reason will be displayed to describe this comment to others. Learn more.
@lboue please add a Testing
section that describes how this was tested. This seems to realistically be "manual" since you described how you built and started the app. We are trying to make the manual testing bar somewhat higher to avoid all PRs being marked manual as a convenience. So we need:
- justification why automated testing is impossible (I would put here that we have many chef examples and building them all is impractical time-wise so we cannot automatically test chef in github CI)
- description of what tests/commands you ran to prove that this new device you added works as a spec-compliand heat pump. Does it pass Device conformance tests? Did you run manual read/writes/invokes on it?
PR #36457: Size comparison from 4e44586 to e227f39 Full report (69 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, linux, nrfconnect, nxp, psoc6, qpg, stm32, telink, tizen)
|
@lboue for future tests of chef devies, it would be useful if we could also verify device conformance on them as part of testing. |
Changes
[Chef] Add heat pump device type.
Specification
This refers to the specification file
24-27351-005_Matter-1.4-Device-Library-Specification.pdf
page 161device_type data_model: HeatPump.xml
Testing
Build
Start
Read temperature value on EP2 (Temperature Sensor)
Read temperature value on EP3 (Temperature Sensor)