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The current board design is three layers (teensy, audio shield, and custom controller board).
Combining the audio module and control module onto a single board and using smaller packages for the MOSFETs would be nice to optimize space in the vehicle.
The text was updated successfully, but these errors were encountered:
The current board design is three layers (teensy, audio shield, and custom controller board).
Combining the audio module and control module onto a single board and using smaller packages for the MOSFETs would be nice to optimize space in the vehicle.
The text was updated successfully, but these errors were encountered: